| PART |
Description |
Maker |
| UN222X UNR2222 UNR2223 UNR2224 UNR2221 |
Silicon NPN epitaxial planar type
Flash Memory IC; Leaded Process Compatible:Yes; Memory Configuration:128K x 8; Memory Size:1Mbit; Package/Case:32-PLCC; Supply Voltage Max:5.5V
Flash Memory IC; Access Time, Tacc:120ns; Package/Case:32-TSOP; Memory Configuration:128K x 8; Memory Size:1Mbit; Supply Voltage Max:5.5V; Mounting
Flash Memory IC; Access Time, Tacc:45ns; Package/Case:32-TSOP; Memory Configuration:128K x 8; Memory Size:1Mbit; Supply Voltage Max:5.5V; Mounting
POT THUMBWHEEL 10K OHM LINEAR
|
Panasonic Semiconductor
Panasonic Corporation
|
| M5M29KE131BVP |
Memory>NOR type Flash Memory
134,217,728-BIT (16,777,216-WORD BY 8-BIT / 8,388,608-WORD BY 16-BIT) CMOS FLASH MEMORY Stacked-uMCP (micro Multi Chip Package)
|
Renesas Electronics Corporation
|
| MX26F128J3TC-15 MX26F128J3TC-12 MX26F128J3XCC-12 M |
Macronix NBit TM Memory Family 128M [x8/x16] SINGLE 3V PAGE MODE eLiteFlash TM MEMORY
|
List of Unclassifed Manufacturers
|
| AM45DL32X8G AM45DL3238GB85IT |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
SPECIALTY MEMORY CIRCUIT, PBGA73
|
ADVANCED MICRO DEVICES INC
|
| DS42516 |
SPECIALTY MEMORY CIRCUIT, PBGA73
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
SPANSION LLC
ADVANCED MICRO DEVICES INC
|
| XRAG208 |
432-bit UHF, EPCglobal Class1 Generation2 and ISO 18000-6C, contactless memory chip with user memory
|
STMicroelectronics
|
| BR34L02FV-WE2 |
DDR1/DDR2 For memory module) SPD Memory
|
Rohm
|
| AM75PDL193CHH70I AM75PDL191CHH70I AM75PDL191CHH040 |
128 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Read/Write Flash Memory SPECIALTY MEMORY CIRCUIT, PBGA73
|
Spansion Inc.
Spansion, Inc.
|
| M49000004C M49000004B M49000004D M49000004E AM49BD |
Stacked Multichip Package (MCP), Flash Memory and pSRAM CMOS 1.8 Volt-only Simultaneous Read/Write SPECIALTY MEMORY CIRCUIT, PBGA89
|
Spansion Inc.
Spansion, Inc.
|
| HT9302G HT9302B |
1-Memory/2-Memory Tone/Pulse Dialer
|
holtek
|
